HEAT suppressor™ by E material LAB — a next-generation passive heat dissipation component that replaces conventional metal heat sinks using Double-Radiation-Cooling Technology® material with High-heat emissivity.
Conventional AL heat sinks average 30 mm+ in height and account for a disproportionate share of system weight.
HEAT suppressor™ at 1.0 mm / <50% weight replaces AL heat sinks with no board redesign required.
Bare aluminum emissivity is only ε = 0.03–0.1 — nearly all heat dissipation relies on conduction, leaving radiation potential untapped.
BLACK metal™ Double-Radiation-Cooling Technology® achieves near-black-body emissivity, unlocking up to +120% thermal performance.
Existing alternatives — graphite sheets, carbon coatings — require process changes or sacrifice mechanical integrity.
HEAT suppressor™ uses the same metal substrate with a functional coating — electrically isolated, >6H hardness, KATECH / KOPTI / KTRI verified.
Nano-porous siloxane resin coated aluminum achieving high-heat emissivity via Double-Radiation-Cooling Technology®. The material foundation behind every HEAT suppressor™.
A proprietary nano-porous functional coating applied to aluminum substrate, engineered to simultaneously absorb and re-radiate thermal energy from both surfaces — achieving near-black-body heat emissivity.
Proprietary surface micro-geometry that induces radiation-driven natural convection — enabling passive airflow with no moving parts. Integrated into HEAT suppressor™ as the optimized form factor product.
ε = 0.98 emissivity delivered directly at the heat source. Electrically isolated, chemically resistant, IC-grade sputtering process.
Macro-structured body. For semiconductor.
Thin sheet body. For crooked & flexible usage.
Add-on HOT SPOT. For module/housing.
Validated across high-growth industry sectors with third-party measured performance data.
All data from third-party validated tests by accredited Korean institutions. No claims rely solely on internal testing.
Replaced anodized aluminum heat sink: 9.0°C lower operating temperature, up to +120% thermal performance, less than 50% the weight.
Automotive interior projection module: +119% thermal performance, 55% weight reduction. Independently certified by KATECH for automotive-grade reliability.
Enterprise network switch: 62% lighter (167g → 63g), +121% thermal performance, 5°C better heat dissipation at steady-state operation.
| Device Type | HEAT suppressor™ | Al Heat Sink (Baseline) | Weight Result | Thermal Result |
|---|---|---|---|---|
| LED Module (150×65) | 63g · 1.0mm | 167g · 30mm | 62% lighter | +5°C better · 3–4°C faster cool-down |
| Digital IC (40×40) | 9g · 1.0mm | 18g | 50% lighter | Equivalent dissipation · Higher radiation efficiency |
| Power FET (TO220) | 2g · 1.0mm | 4g | 50% lighter | Equivalent conduction · Faster thermal response |
E material LAB is a deep-tech startup developing next-generation passive heat dissipation components to replace conventional aluminum heat sinks. Our mission: deliver HEAT suppressor™ — lighter, thinner, thermally superior — through Double-Radiation Cooling and FANless-FAN™ geometry.
Core team rooted in Korean national research institutes and semiconductor industry, with deep expertise in functional materials, process engineering, and thermal management.
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